– Intel announced the ‘Semiconductor Co-Investment Program (SCIP),’ which jointly finances investment in semiconductor production facilities with Brookfield Asset Management.
– SCIP, which Intel describes as the industry’s first new financing model, aims to enhance financial flexibility by sharing a certain percentage of the huge cost of the semiconductor production facility that Intel will build in the future with external investors or asset managers.
– According to this agreement between Intel and Brookfield, joint investment of $15 billion each in a production facility in Chandler, Arizona, USA, which is currently under construction, for a total of $30 billion (Intel owns 51%, Brookfield owns 49%)
SCIP is expected to provide Intel with a cumulative profit of $15 billion by allowing Intel to leverage its new capital pool while maintaining cash flow and financial structure for future investments.
Intel Announces ‘Semiconductor Joint Investment Program’
